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Title:
発光素子の製造方法
Document Type and Number:
Japanese Patent JP5666164
Kind Code:
B2
Abstract:
Provided is a light-emitting device and a method of manufacturing the same. The light-emitting device includes a substrate having at least one protruded portion with a curved surface in which a consistent defect density and uniform stress distribution can be obtained even when the growth of the semiconductor crystal layer and the forming of the light-emitting device are completed. In addition, the light-emitting device has a high the light extraction efficiency for extracting light generated at an electroluminescense layer externally.

Inventors:
李 庭 旭
成 演 準
趙 濟 煕
白 好 善
Application Number:
JP2010105599A
Publication Date:
February 12, 2015
Filing Date:
April 30, 2010
Export Citation:
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Assignee:
三星電子株式会社Samsung Electronics Co.,Ltd.
International Classes:
H01L33/22; H01L21/205; H01L21/3065; H01L27/15; H01L33/32; H01S5/00
Attorney, Agent or Firm:
Patent business corporation symbiosis international patent firm



 
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