Title:
多層３次元構造を製造するための方法
Document Type and Number:
Japanese Patent JP5668124
Kind Code:
B2
Abstract:
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
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Inventors:
アダム エル コーエン
Application Number:
JP2013232987A
Publication Date:
February 12, 2015
Filing Date:
November 11, 2013
Export Citation:
Assignee:
ユニバーシティ オブ サザン カリフォルニア
International Classes:
B81C1/00; C25D1/00; B21C37/00; C23F1/00; C25D1/10; C25D5/02; C25D5/10; C25D7/12; C25D17/06; C25D19/00; C25D21/12; H01L21/288; H05K3/24; C25D
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm