Title:
リソグラフィ方法および装置
Document Type and Number:
Japanese Patent JP5669871
Kind Code:
B2
Abstract:
A method of patterning substrates using a lithographic apparatus. The method comprising providing a beam of radiation using an illumination system, using a patterning device to impart the radiation beam with a pattern in its cross-section, and using a projection system to project the patterned radiation beam onto target portions of a lot of substrates, wherein the method further comprises performing a radiation beam aberration measurement after projecting the patterned radiation beam onto a subset of the lot of substrates, performing an adjustment of the projection system using the results of the radiation beam aberration measurement, then projecting the patterned radiation beam onto a further subset of the lot of substrates.
Inventors:
バセルマンズ，ヨハネス，ヤコブス，マシューズ
ヤスペール， ヨハネス， クリスティアーン， マリア
ヤスペール， ヨハネス， クリスティアーン， マリア
Application Number:
JP2013025770A
Publication Date:
February 18, 2015
Filing Date:
February 13, 2013
Export Citation:
Assignee:
エーエスエムエル ネザーランズ ビー．ブイ．
International Classes:
H01L21/027; G03F7/20
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki