Title:
モジュール基板及びモジュール基板の製造方法
Document Type and Number:
Japanese Patent JP5673123
Kind Code:
B2
Inventors:
大坪 喜人
Application Number:
JP2011009174A
Publication Date:
February 18, 2015
Filing Date:
January 19, 2011
Export Citation:
Assignee:
株式会社村田製作所
International Classes:
H05K1/14; H01L23/12; H01L25/00; H05K3/36
Attorney, Agent or Firm:
Masaya Fukunaga