Title:
電子部品用硬化性異方性導電材料、接続構造体及び接続構造体の製造方法
Document Type and Number:
Japanese Patent JP5681327
Kind Code:
B2
Abstract:
Provided is a curable composition that is for an electronic component, can be rapidly cured, and furthermore can have increased conductivity even when connected to a copper electrode. The curable composition for an electronic component is used when connecting to a copper electrode. The curable composition for an electronic component contains a heat-curable compound, a latent curing agent, and an imidazole compound having an aromatic skeleton.
Inventors:
石澤 英亮
久保田 敬士
久保田 敬士
Application Number:
JP2014504102A
Publication Date:
March 04, 2015
Filing Date:
January 16, 2014
Export Citation:
Assignee:
積水化学工業株式会社
International Classes:
H01B1/20; C08G59/56; C08G59/68; C08K9/02; H01L21/60
Domestic Patent References:
| JP2001081155A | 2001-03-27 | |||
| JP2012092321A | 2012-05-17 | |||
| JP2012158730A | 2012-08-23 | |||
| JP2012021114A | 2012-02-02 | |||
| JP2012124479A | 2012-06-28 |
Attorney, Agent or Firm:
Patent business corporation Miyazaki and table-of-contents patent firm