Title:
実装装置、電子部品の実装方法及び基板の製造方法
Document Type and Number:
Japanese Patent JP5686321
Kind Code:
B2
Abstract:
A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.
Inventors:
石田 啓介
Application Number:
JP2011079858A
Publication Date:
March 18, 2015
Filing Date:
March 31, 2011
Export Citation:
Assignee:
ＪＵＫＩオートメーションシステムズ株式会社
International Classes:
H05K13/04
Attorney, Agent or Firm:
Omori Junichi