Title:
ＬＥＤ照明筐体用の放熱性樹脂組成物及びそのＬＥＤ照明用放熱性筐体
Document Type and Number:
Japanese Patent JP5688409
Kind Code:
B2
Abstract:
Provided is a novel heat-dissipating resin composition used for an LED light housing, the composition having excellent heat dissipation, fire retardancy, insulation properties, and molding processability as well as low specific gravity and improved whiteness. Also provided is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition. Disclosed is a heat-dissipating resin composition used for an LED light housing, comprising: 100 parts by mass of a thermoplastic resin composition (X) comprising 40 to 65% by mass of a polyamide resin (A), 33.5 to 59.8% by mass of a metal-hydroxide-based fire retardant (B), and 0.2 to 1.5% by mass of a polytetrafluoroethylene resin (C); and 5 to 200 parts by mass of an inorganic filler (Y) comprising 5 to 100% by mass of boron nitride (D) and 0 to 95% by mass of an inorganic oxide filler (E), wherein thermal conductivity is equal to or greater than 1.0 W/m·K. Also, disclosed is a heat-dissipating housing for LED lighting, the housing being molded using the heat-dissipating resin composition.
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Inventors:
下木場 裕一
野口 哲央
石井 聡
野口 哲央
石井 聡
Application Number:
JP2012509438A
Publication Date:
March 25, 2015
Filing Date:
March 25, 2011
Export Citation:
Assignee:
電気化学工業株式会社
International Classes:
C08L77/00; C08K3/22; C08K3/38; C08L27/18; F21S2/00
Domestic Patent References:
| JP2009167358A | 2009-07-30 | |||
| JP2004026982A | 2004-01-29 | |||
| JP2008270709A | 2008-11-06 | |||
| JP2010534257A | 2010-11-04 |
Attorney, Agent or Firm:
SK patent business corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito