Title:
電子デバイスとその製造方法
Document Type and Number:
Japanese Patent JP5692218
Kind Code:
B2
Abstract:
When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device 1 includes a first glass substrate 2, a second glass substrate 3 and a sealing layer 8 to seal an electronic element portion disposed between these glass substrates 2 and 3. The sealing layer 8 is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates 1 and 2, each reacted layer 11 is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.
Inventors:
Sohei Kawanami
Yoshinori Ami
Nobuko Mitsui
Yoshinori Ami
Nobuko Mitsui
Application Number:
JP2012505770A
Publication Date:
April 01, 2015
Filing Date:
March 18, 2011
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
International Classes:
G09F9/30; G02F1/13; G02F1/1339; G09F9/00
Domestic Patent References:
| JP2008059802A | 2008-03-13 | |||
| JP2008115057A | 2008-05-22 | |||
| JP2009227566A | 2009-10-08 | |||
| JP2007008808A | 2007-01-18 | |||
| JP2000169168A | 2000-06-20 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office