マスクおよび半導体装置の製造方法

Title:

マスクおよび半導体装置の製造方法

Document Type and Number:

Japanese Patent JP5696079

Kind Code:

B2

Abstract:

A photo mask for exposing according to an embodiment includes a mark pattern arranged in a mark region that is different from an effective region to form a semiconductor device; and a regular pattern arranged in the mark region and around the mark pattern and smaller than the mark pattern in size and pitch.

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Inventors:

Yosuke Okamoto
Ishigaki Kazuki
Kuriyama Ikuhi

Application Number:

JP2012065382A

Publication Date:

April 08, 2015

Filing Date:

March 22, 2012

Export Citation:

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Assignee:

Toshiba Corporation

International Classes:

G03F1/42; G03F1/44; H01L21/027

Domestic Patent References:

JP2008225224A
JP2006126614A
JP2006293081A
JP2008235715A
JP10064796A
JP2007207822A
JP2038803A
JP2008218516A
JP2009212518A
JP2011238919A

Foreign References:

WO2012013638A1

Attorney, Agent or Firm:

Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama

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