Title:
半導体装置
Document Type and Number:
Japanese Patent JP5699322
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve reliability of packaging though heat stress is applied by approximating a thermal expansion coefficient of the semiconductor device with a thermal expansion coefficient of a mounting board.SOLUTION: A semiconductor device 20 comprises a lead frame 10 including a die pad 15 and a plurality of lead parts 16 disposed around the die pad 15, a semiconductor element 21 loaded on the die pad 15 of the lead frame 10, and bonding wires 22 electrically connecting the lead parts 16 of the lead frame 10 with the semiconductor element 21. The lead frame 10, the semiconductor element 21 and the bonding wires 22 are encapsulated by an encapsulation resin part 23. The encapsulation resin part 23 has the semiconductor element 21, a central region 24 provided around the semiconductor element 21 and a peripheral region 25 provided on the circumference ot the central region 24. A thickness of the central region 24 is thicker than a thickness of the peripheral region 25.
Inventors:
Masuda Masuda
Koji Tomita
Okamoto
Suzuki Hiromichi
Koji Tomita
Okamoto
Suzuki Hiromichi
Application Number:
JP2010217494A
Publication Date:
April 08, 2015
Filing Date:
September 28, 2010
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/28; H01L23/50
Domestic Patent References:
| JP2010199412A | ||||
| JP10154768A | ||||
| JP2004165525A | ||||
| JP2009231322A | ||||
| JP2008227531A | ||||
| JP7211852A |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Takuhisa Murata
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Takuhisa Murata