Title:
貼り合わせウェーハの製造方法
Document Type and Number:
Japanese Patent JP5703853
Kind Code:
B2
Inventors:
Toru Ishitsuka
Norihiro Kobayashi
Nobuhiko Noto
Norihiro Kobayashi
Nobuhiko Noto
Application Number:
JP2011047895A
Publication Date:
April 22, 2015
Filing Date:
March 04, 2011
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/02; H01L27/12
Domestic Patent References:
| JP2008277552A | ||||
| JP2012507870A | ||||
| JP10326883A | ||||
| JP2011181907A | ||||
| JP2006303101A | ||||
| JP2001230393A | ||||
| JP2007194349A |
Foreign References:
| WO2010059367A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya