Title:
浸漬銀コーティング上の自己組織化分子
Document Type and Number:
Japanese Patent JP5707135
Kind Code:
B2
Abstract:
A composition for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate. The composition comprises: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.
Inventors:
Avis, Joseph, A.
San, Shen Liang
Antonellis, Theodore
San, Shen Liang
Antonellis, Theodore
Application Number:
JP2010533315A
Publication Date:
April 22, 2015
Filing Date:
November 10, 2008
Export Citation:
Assignee:
Enson Incorporated
International Classes:
C23F11/00; B05D7/14
Domestic Patent References:
| JP9249977A | ||||
| JP3252006A | ||||
| JP2004169157A | ||||
| JP2000282033A | ||||
| JP2004510886A |
Foreign References:
| WO2005075706A1 |
Attorney, Agent or Firm:
Teruo Akimoto
Toshiro Ochi
Toshiro Ochi