Title:
真空下で基板を急速に加熱および冷却して次いで即座に基板をコーティングする方法および装置
Document Type and Number:
Japanese Patent JP5707422
Kind Code:
B2
Abstract:
The method for heating a substrate (20) and then coating immediately in a vacuum chamber, comprises arranging the substrate on a substrate-holder (24) so that the bottom of the substrate of the substrate surface-holder is contacted in flat manner, lifting the substrate relative to the substrate-holder around a distance, heating the substrate lifted over its surface with a heating device (22), immediately coating the hot substrate, lowering the substrate on the substrate-holder, cooling the substrate, and arranging a heat accumulator between the substrate holder and the lifted substrate. The method for heating a substrate (20) and then coating immediately in a vacuum chamber, comprises arranging the substrate on a substrate-holder (24) so that the bottom of the substrate of the substrate surface-holder is contacted in flat manner, lifting the substrate relative to the substrate-holder around a distance, heating the substrate lifted over its surface with a heating device (22), immediately coating the hot substrate, lowering the substrate on the substrate-holder, cooling the substrate, which is coated, and arranging a heat accumulator between the substrate holder and the lifted substrate. The heating device is controlled over a temperature sensor for determining the substrate-temperature and a temperature control device for adjusting a predetermined temperature. The coating the hot surface comprises an immediate movement of the heated substrate together with the substrate-holder in the coating position and the coating of the substrate, which is lifted in the coating of the substrate around 1-10 mm against the substrate-holder. The heating device consists of infrared-emitters under use of the filter layers, so that the radiated infrared-light contains wavelengths, which are absorbed either by the substrate or by the applied layer system. The substrate holder is cooled. The cooling substrate, after cooling together with the substrate-holder, moves immediately into the coating position, where the substrate is coated. A tempering of the substrate is sequentially processed on different temperatures with subsequent coating respectively in individual steps. An independent claim is included for a system for heating a substrate in a vacuum chamber.
Inventors:
Wolfram Mars
Berthold Ocker
Jürgen Langer
Helmut Yong
Berthold Ocker
Jürgen Langer
Helmut Yong
Application Number:
JP2012554321A
Publication Date:
April 30, 2015
Filing Date:
February 22, 2011
Export Citation:
Assignee:
SINGULUS TECHNOLOGIES AG
International Classes:
C23C14/54; C23C14/34; G11B5/31; G11B5/39
Domestic Patent References:
| JP2002530883A | ||||
| JP9078225A | ||||
| JP2002050809A | ||||
| JP8052341A | ||||
| JP2000219960A |
Foreign References:
| US6301434 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Keiichi
Yoshida Tamaki
Kyousei Tamura
Keiichi
Yoshida Tamaki