Title:
ワークの研磨装置
Document Type and Number:
Japanese Patent JP5708864
Kind Code:
B2
Abstract:
In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.
More Like This:
| JPS62287967 | LAPPING CARRIER |
Inventors:
Shinichi Ogata
Ryuichi Tanimoto
Keiichi Takanashi
Ryuichi Tanimoto
Keiichi Takanashi
Application Number:
JP2014085626A
Publication Date:
April 30, 2015
Filing Date:
April 17, 2014
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B37/28; B24B49/12; B24B49/14; H01L21/304
Domestic Patent References:
| JP2008235899A | ||||
| JP2001353658A | ||||
| JP2000271857A |
Attorney, Agent or Firm:
Kenji Sugimura
Keisuke Kawahara
Yamaguchi Yusuke
Keisuke Kawahara
Yamaguchi Yusuke