Title:
シリコン構造体の製造及びプロファイル制御を伴うシリコンディープエッチング
Document Type and Number:
Japanese Patent JP5710267
Kind Code:
B2
Inventors:
Kebi robert
Lynn Frank
Winikzek Yaroslow
Chen Wan-Lin
McDonnell Erin
Zen Lily
Russig Stephen
Bogart Jeff
Ruth Camellia
Lynn Frank
Winikzek Yaroslow
Chen Wan-Lin
McDonnell Erin
Zen Lily
Russig Stephen
Bogart Jeff
Ruth Camellia
Application Number:
JP2010539663A
Publication Date:
April 30, 2015
Filing Date:
December 12, 2008
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065
Domestic Patent References:
| JP4137751A | ||||
| JP10256260A | ||||
| JP1092798A | ||||
| JP2007103876A | ||||
| JP2005175460A |
Foreign References:
| US20070020936 | ||||
| WO2006083592A1 |
Attorney, Agent or Firm:
Meisei International Patent Office