Title:
ウエハレベルレンズ用チタンブラック分散物、それを含有する感光性樹脂組成物、ウエハレベルレンズ、及び、固体撮像素子
Document Type and Number:
Japanese Patent JP5710283
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for wafer level lens that is superior in hardenability and can reduce a residual object originated in a photosensitive resin outside a formation region of a shading film, and to provide a titanium black dispersion for wafer level lens used for the photosensitive resin composition, and a wafer level lens with a shading film formed by using the photosensitive resin composition.SOLUTION: The titanium black dispersion for wafer level lens contains: (A) titanium black particles; (B) a dispersion agent; and (C) an organic solvent, wherein an object to be dispersed containing the (A) titanium black particles contains Si atoms, and the content ratio (Si/Ti) of Si atoms and Ti atoms in the object to be dispersed is 0.05 or more. The photosensitive resin composition for wafer level lens contains the titanium black dispersion, (D) a photopolymerizable compound, and (E) a photopolymerizable initiator.
Inventors:
Makoto Kubota
Application Number:
JP2011005196A
Publication Date:
April 30, 2015
Filing Date:
January 13, 2011
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C08K3/22; C08L51/00; G02B1/04; G02B3/00; G02B5/00; G02B7/02
Domestic Patent References:
| JP2008266045A |
Foreign References:
| WO2008093516A1 | ||||
| US20080113273 | ||||
| WO2009116442A1 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda