Title:
はんだ検査方法及びはんだ検査装置
Document Type and Number:
Japanese Patent JP5720659
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To specify a solder paste which can be recycled without using an organic solvent.SOLUTION: A solder inspection method includes a cleaning step, a first determination step, and a second determination step. In the cleaning step, a part of solder paste is cleaned. In the first determination step, a surface analysis is performed on a surface of a solder powder obtained in the cleaning step, and it is determined whether both carbon depth dc and oxygen depth do are smaller than a first reference value. Then, in the second determination step, it is determined whether the carbon depth dc is smaller than the oxygen depth do when both values are determined to be smaller than the first reference value in the first determination step.
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Inventors:
Fujima Miko
Application Number:
JP2012257460A
Publication Date:
May 20, 2015
Filing Date:
November 26, 2012
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K35/40; C22B7/00
Domestic Patent References:
| JP2010156027A | ||||
| JP2001267730A | ||||
| JP2004233146A | ||||
| JP2001320162A | ||||
| JP2000307239A | ||||
| JP9070692A |
Attorney, Agent or Firm:
Mamoru Takada
Hideki Takahashi
Jiro Ozawa
Hideki Takahashi
Jiro Ozawa