Title:
円筒型スパッタリングターゲット材、それを用いた配線基板及び薄膜トランジスタの製造方法
Document Type and Number:
Japanese Patent JP5723247
Kind Code:
B2
Inventors:
Ueda Takashiro
Noriyuki Tatsumi
Ryuichi Kobayashi
Noriyuki Tatsumi
Ryuichi Kobayashi
Application Number:
JP2011196991A
Publication Date:
May 27, 2015
Filing Date:
September 09, 2011
Export Citation:
Assignee:
Sh Copper Products Co., Ltd.
International Classes:
C23C14/34
Domestic Patent References:
| JP2009512779A | ||||
| JP2009535519A | ||||
| JP2010056258A |
Foreign References:
| WO2007045387A1 | ||||
| WO2006103833A1 | ||||
| US20070251819 |