Title:
固体撮像装置の製造方法
Document Type and Number:
Japanese Patent JP5724322
Kind Code:
B2
Abstract:
A solid-state imaging device (1) includes a supporting substrate (3) that includes a concave portion (2), a solid-state imaging chip (4) that is bonded on the supporting substrate (3) so as to seal the concave portion (2) in a view-angle region, a stress film (5) that is formed on the surface of the solid-state imaging chip (4), and an imaging surface curved toward the concave portion (2) at least in the view-angle region.
Inventors:
Soichiro Itonaga
Application Number:
JP2010260973A
Publication Date:
May 27, 2015
Filing Date:
November 24, 2010
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/14; H01L27/146; H04N5/225; H04N5/369; H04N5/374
Domestic Patent References:
| JP2007266380A | ||||
| JP2005064060A | ||||
| JP2005243960A | ||||
| JP2009049499A | ||||
| JP2008294960A | ||||
| JP2005191218A |
Attorney, Agent or Firm:
Shinto International Patent Office