Title:
冷却ユニット，電子機器及び案内部材
Document Type and Number:
Japanese Patent JP5725039
Kind Code:
B2
Abstract:
Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.
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| JP2000031356 | HEAT SINK AND MANUFACTURE THEREOF |
| WO/2024/095685 | COOLING MODULE |
Inventors:
Masaki Iwata
Application Number:
JP2012550637A
Publication Date:
May 27, 2015
Filing Date:
December 28, 2010
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K7/20; G06F1/20
Domestic Patent References:
| JP2008140055A | 2008-06-19 | |||
| JP2009064349A | 2009-03-26 | |||
| JP2007172328A | 2007-07-05 | |||
| JPH10247712A | 1998-09-14 | |||
| JP2007172328A | 2007-07-05 | |||
| JPH10247712A | 1998-09-14 | |||
| JP2008140055A | 2008-06-19 | |||
| JP2009064349A | 2009-03-26 |
Foreign References:
| CH283612A | 1952-06-15 | |||
| FR1392029A | 1965-03-12 | |||
| FR2166276A1 | 1973-08-17 | |||
| GB533718A | 1941-02-19 | |||
| US2151733A | 1939-03-28 |
Attorney, Agent or Firm:
Yu Sanada
Masahisa Yamamoto
Masahisa Yamamoto