半導体装置及びその製造方法並びに電子機器

Title:

半導体装置及びその製造方法並びに電子機器

Document Type and Number:

Japanese Patent JP5726110

Kind Code:

B2

More Like This:

WO/2019/204185	TWO PIECE SHUTTER DISK ASSEMBLY WITH SELF-CENTERING FEATURE
WO/2003/012837	SEMICONDUCTOR MANUFACTURING APPARATUS CONTROL SYSTEM
WO/2015/060942	BIPOLAR COLLIMATOR UTILIZED IN A PHYSICAL VAPOR DEPOSITION CHAMBER

Inventors:

Yasuaki Kodaira
Utsunomiya Juno

Application Number:

JP2012055794A

Publication Date:

May 27, 2015

Filing Date:

March 13, 2012

Export Citation:

Assignee:

Samsung Electronics Co.,Ltd.

International Classes:

H01L21/02; H01L27/12

Domestic Patent References:

Attorney, Agent or Firm:

Kyosei International Patent Office

Previous Patent: 遊技機

Next Patent: PRODUCTION OF CAST IRON BY SHAFT FURNACE