Title:
電力用半導体装置
Document Type and Number:
Japanese Patent JP5734493
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small power semiconductor device capable of connecting an external terminal connection member to a conductor connected to a semiconductor element with high position accuracy without providing an edge having a complicated shape, and connecting an external terminal to the external terminal connection member from an upper surface of the power semiconductor device.SOLUTION: A power semiconductor device 1 comprises: semiconductor elements 14 and 15; a conductor 13 to which the semiconductor elements 14 and 15 are connected; a base plate 25 disposed on the conductor 13 via an insulating layer 24; and a columnar external terminal connection member 16 connected to the conductor 13. The conductor 13 includes an arrangement part for positioning the external terminal connection member 16 on a surface on the side opposite to the insulating layer 24 in a predetermined allowable range. The arrangement part of the conductor 13 includes a hollow 17 in a part in an insulating layer direction from the surface on the side opposite to the insulating layer 24. An upper part of the hollow 17 is formed narrower than a bottom of the hollow 17. The external terminal connection member 16 is mounted in the hollow 17 of the arrangement part.
Inventors:
Minoru Egusa
Seiji Oka
Junji Fujino
Kaoru Shige
Seiji Oka
Junji Fujino
Kaoru Shige
Application Number:
JP2014103984A
Publication Date:
June 17, 2015
Filing Date:
May 20, 2014
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2010027813A | ||||
| JP2007027467A | ||||
| JP2010129671A | ||||
| JP2010283107A |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa