Title:
半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5738786
Kind Code:
B2
Abstract:
According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality of first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires.
Inventors:
Takaki Hashimoto
Yasunobu Kai
Toshiya Kotani
Yasunobu Kai
Toshiya Kotani
Application Number:
JP2012036187A
Publication Date:
June 24, 2015
Filing Date:
February 22, 2012
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/768; H01L21/28; H01L21/336; H01L21/8247; H01L27/115; H01L29/788; H01L29/792
Domestic Patent References:
| JP2011258822A | ||||
| JP2007281428A | ||||
| JP2009146966A | ||||
| JP2008300740A |
Foreign References:
| WO2006070474A1 |
Attorney, Agent or Firm:
Hiroaki Sakai