Title:
電子部品の樹脂封止成形方法及び装置
Document Type and Number:
Japanese Patent JP5744683
Kind Code:
B2
Inventors:
Yohei Onishi
Application Number:
JP2011189918A
Publication Date:
July 08, 2015
Filing Date:
August 31, 2011
Export Citation:
Assignee:
towa corporation
International Classes:
B29C45/34; B29C45/02; H01L21/56
Domestic Patent References:
| JP201036515A |