半導体装置およびその製造方法 - Semiconductor Components Industries Limited Liability Company

Title:

半導体装置およびその製造方法

Document Type and Number:

Japanese Patent JP5745238

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To solve the problem in which: once a conductive fastening material used for fastening a semiconductor element leaks out to the periphery of the semiconductor element, the adhesion between the conductive fastening material and a sealing resin deteriorates to cause the adhesion between the sealing resin and an island to also deteriorate, and on the other hand, if the conductive fastening material does not leak out to the periphery of the semiconductor element at all, the wet state of the conductive fastening material cannot visually observed.SOLUTION: A semiconductor device comprises an island, a semiconductor element fastened on a main plane of the island by a conductive fastening material, a lead which is electrically connected to the semiconductor element and which is partially led out to the outside, and a sealing resin covering the foregoing integrally. The main plane of the island is provided with a belt-like groove along the side of the semiconductor element. The groove is discontinuous below a corner part of the semiconductor element. In the case where the conductive fastening material becomes liquid by reflow, it is restricted by the groove, so that the leakage from the side of the semiconductor element can be reduced. In a region where the groove is discontinuous, a slight amount of conductive fastening material is leaked out to allow the wet state of the conductive fastening material to be visually observed.

Inventors:

Shigeharu Yoshiha
Shinobu Tsukahara
Masakazu Watanabe

Application Number:

JP2010172642A

Publication Date:

July 08, 2015

Filing Date:

July 30, 2010

Export Citation:

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