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Title:
強化熱可塑性樹脂組成物
Document Type and Number:
Japanese Patent JP5746890
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a reinforced thermoplastic resin composition capable of providing a molded product in which deterioration of rigidity upon humidity adsorption is reduced, moreover, which has excellent shock resistance and heat resistance when a high load is applied and which is excellent also in designability upon coating.SOLUTION: The reinforced thermoplastic resin composition includes: a graft copolymer (A) prepared by graft-polymerizating 25 to 60 pts.mass of monomer mixture which includes 60 to 95 mass% of vinyl aromatic monomer (b) and 5 to 40 mass% of vinyl cyanate monomer (c) in the presence of 40 to 75 pts.mass of rubbery polymer (a); a maleimide based copolymer (B) prepared by copolymerizing 5 to 50 mass% of maleimide based monomer (d) and 50 to 95 mass% of other monomer copolymerizable with the maleimide based monomer (d); a polyamide resin (C) having a relative viscosity of 1.8 to 3.0; a compatibilizer (D); and inorganic filler (E), in specific amounts.

Inventors:
Yoshitaka Naito
Koichi Tezuka
Application Number:
JP2011068225A
Publication Date:
July 08, 2015
Filing Date:
March 25, 2011
Export Citation:
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Assignee:
UMG ABS Co., Ltd.
International Classes:
C08L77/00; C08K3/00; C08L35/00; C08L51/04
Domestic Patent References:
JP2007224287A
JP2009256647A
JP2002212383A
JP2009179675A
JP11286587A
JP2006008722A
JP2005307180A
JP2003277567A
Foreign References:
US20100036043
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama