Title:
半導体装置
Document Type and Number:
Japanese Patent JP5748547
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that can improve connection reliability.SOLUTION: A semiconductor device is configured so that when a terminal end part 110 of the semiconductor device is inserted into a through hole 201 of a substrate 200, the terminal end part is mechanically and electrically connected to the substrate. The semiconductor device includes: a branch part which is disposed at the terminal end part, and has branch members 112 branched into a plurality of pieces at an end part of the branch part; and a press-contact member 301 which is inserted from one side of the through hole with respect to the branch members inserted from the other side of the through hole, and forcedly widens the individual branch members so as to be press-contacted with the internal surface of the through hole.
Inventors:
Minoru Egusa
Shiori Idaka
Seiji Oka
Tetsuya Ueda
Junichi Murai
Shiori Idaka
Seiji Oka
Tetsuya Ueda
Junichi Murai
Application Number:
JP2011099008A
Publication Date:
July 15, 2015
Filing Date:
April 27, 2011
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/48; H01R12/58
Domestic Patent References:
| JP2004349632A | ||||
| JP2009016189A | ||||
| JP2009021016A |
Attorney, Agent or Firm:
Takuji Yamada
Mitsuo Tanaka
Mikio Takeuchi
Mitsuo Tanaka
Mikio Takeuchi