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Japanese Patent JP5756500

B2

There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.

JP3544930	FLEXIBLE PRINTED BOARD AND ELECTRONIC APPARATUS USING THE SAME
JP2006019416	CIRCUIT ORIGINAL SUBSTRATE, CIRCUIT SUBSTRATE MODULE MANUFACTURING METHOD AND ELECTRONIC CLOCK
JP2008166496	FLEXIBLE WIRING BOARD

Eiji Mugiya
Kenzo Kitazaki
Masaya Shimamura

JP2013170459A

July 29, 2015

August 20, 2013

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TAIYO YUDEN CO.,LTD.

H05K1/02; H01L23/28; H01L25/04; H01L25/18; H05K1/18; H05K3/28; H05K3/46; H05K9/00

JP2003197849A
JP2004179573A
JP2005317935A
JP2007110095A
JP2010225620A
JP201219091A
JP2012256842A
JP201326280A

WO2012101920A1
WO2012046829A1

Junichi Omori
Ori Akira
Hiroki Yamada
Masayoshi Sekine
Teppei Nakamura
Ayako Kaneko
Nozomi Yoshida
Shintaro Kanayama

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