Title:
高熱伝導性熱可塑性樹脂
Document Type and Number:
Japanese Patent JP5757940
Kind Code:
B2
Abstract:
Provided is a thermoplastic resin having excellent thermal conductivity, in which thermoplastic resin a change in number average molecular mass caused by progress of polymerization occurring when the thermoplastic resin material is melted and a change in thermal conductivity caused by the change in number average molecular mass are low. The thermoplastic resin has (A) a specific structure and (B) ends of molecular chains sealed by a monofunctional low molecular weight compound. The resin itself has excellent thermal conductivity. The change in number average molecular mass becomes small during melting of the thermoplastic resin material, so that the change in thermal conductivity of the resin itself becomes small.
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Inventors:
Shusuke Yoshihara
E Saki Toshiro
Kazuaki Matsumoto
E Saki Toshiro
Kazuaki Matsumoto
Application Number:
JP2012511536A
Publication Date:
August 05, 2015
Filing Date:
April 14, 2011
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08G85/00; C08G63/16
Domestic Patent References:
| JPS57133124A | 1982-08-17 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark