Title:
有機ＥＬ素子用面封止剤およびその硬化物
Document Type and Number:
Japanese Patent JP5763280
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a heat-curable composition which can form a cured layer having a highly smooth surface on an object to be coated, e.g., an organic EL element, with little ruggedness or cissing. This heat-curable composition comprises (A) a cationically polymerizable compound having two or more cationically polymerizable functional groups in the molecule, (B) an initiator for thermal cationic polymerization, (C) a polyether compound (which is not the compound having cationically polymerizable functional groups), and (D) a leveling agent. The composition has a viscosity, as measured with an E-type viscometer at 25°C and 2.5 rpm, of 50-30,000 mPa·s.
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Inventors:
Yugo Yamamoto
Jun Okabe
Jun Okabe
Application Number:
JP2014547612A
Publication Date:
August 12, 2015
Filing Date:
June 10, 2014
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L63/00; C08G59/68; C08L33/08; C08L71/02; C08L83/04; H05B33/04
Domestic Patent References:
| JP2010248387A | 2010-11-04 | |||
| JP2012057124A | 2012-03-22 | |||
| JP2013241568A | 2013-12-05 | |||
| JP2010100736A | 2010-05-06 | |||
| JP2012211327A | 2012-11-01 | |||
| JP2009203431A | 2009-09-10 | |||
| JP2008031424A | 2008-02-14 | |||
| JP2005240005A | 2005-09-08 | |||
| JP2013018921A | 2013-01-31 | |||
| JP2010248387A | 2010-11-04 | |||
| JP2012057124A | 2012-03-22 | |||
| JP2013241568A | 2013-12-05 | |||
| JP2010100736A | 2010-05-06 | |||
| JP2012211327A | 2012-11-01 | |||
| JP2009203431A | 2009-09-10 | |||
| JP2008031424A | 2008-02-14 |
Attorney, Agent or Firm:
Koichi Washida
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