Title:
配線・配管装置、配線・配管材設置構造、及び、配線・配管材を配設するための管接続体及び断熱材の設置方法
Document Type and Number:
Japanese Patent JP5767152
Kind Code:
B2
Inventors:
Atsushi Nakamura
Application Number:
JP2012080954A
Publication Date:
August 19, 2015
Filing Date:
March 30, 2012
Export Citation:
Assignee:
Mirai Industry Co., Ltd.
International Classes:
E04B1/76; F16L5/00
Domestic Patent References:
JP2009240115A | ||||
JP2010060054A | ||||
JP2002228049A | ||||
JP2011185354A | ||||
JP6463U | ||||
JP5667839U | ||||
JP2008149260A | ||||
JP3104365U |
Attorney, Agent or Firm:
Hiroe Associates Patent Office
Previous Patent: 情報表示装置
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