Title:
架橋ポリイミド樹脂、接着剤樹脂組成物及びその硬化物、カバーレイフィルム並びに回路基板
Document Type and Number:
Japanese Patent JP5777944
Kind Code:
B2
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Inventors:
Tetsuya Nakanishi
Ryo Mori
Yoshiki Sudo
Ryo Mori
Yoshiki Sudo
Application Number:
JP2011131609A
Publication Date:
September 09, 2015
Filing Date:
June 13, 2011
Export Citation:
Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
C08G73/10; C09J7/02; C09J11/04; C09J179/08; H05K3/28
Domestic Patent References:
| JP10231362A | ||||
| JP2004051970A | ||||
| JP2010204146A | ||||
| JP2010006983A | ||||
| JP2000319390A | ||||
| JP2006312268A | ||||
| JP9173801A |
Foreign References:
| US20050165196 | ||||
| US5859181 | ||||
| WO2011052376A1 | ||||
| WO2010143667A1 |
Attorney, Agent or Firm:
Katsumi Hoshimiya
Kazuhiro Watanabe
Tatsuya Josawa
Kazuhiro Watanabe
Tatsuya Josawa