Title:
リジッドフレキシブル印刷回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP5778825
Kind Code:
B2
Abstract:
A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
Inventors:
Li, Yang Jae
Kim, Ji Hoon
Shin, Jeho
Cho, Hyun Ju
Kim, Ji Hoon
Shin, Jeho
Cho, Hyun Ju
Application Number:
JP2014106033A
Publication Date:
September 16, 2015
Filing Date:
May 22, 2014
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP2006332280A | ||||
| JP2013074270A |
Attorney, Agent or Firm:
Ippei Watanabe
Hiroyuki Sato
Shigeru Koike
Hiroyuki Sato
Shigeru Koike