Title:
鉄シリコン合金の製造方法
Document Type and Number:
Japanese Patent JP5780851
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an iron silicon alloy of high purity that can be convertible to β iron silicide and a semiconductor or the like without passing a fusing process and a pulverization mixing process.SOLUTION: An iron powder of a grain size of at most 10 μm and a silicon powder of a grain size of at most 10 μm are filled in a sintering mold, and the powder is performed with DC pulse energizing while being pressurized by a pulse electric current sintering method, thereby plasma discharge is generated, the movement of an ion becomes a high speed by a field action, and the removal of an oxide and an adsorption gas that exist in the powder is effectively performed, and a sintered body that makes αFeSia principal ingredient, and in which the quality is excellent and exact.
Inventors:
Akira Kosugi
Takeshi Akatsuka
Takeshi Akatsuka
Application Number:
JP2011141134A
Publication Date:
September 16, 2015
Filing Date:
June 24, 2011
Export Citation:
Assignee:
Naoetsu Electronics Industry Co., Ltd.
International Classes:
B22F3/14; B22F3/24; H01L35/14; H01L35/34
Domestic Patent References:
| JP6069548A | ||||
| JP2004088080A |
Foreign References:
| WO2010055615A1 |
Attorney, Agent or Firm:
Eichi International Patent Office
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