Title:
特定欠陥の検出方法、特定欠陥の検出システムおよびプログラム
Document Type and Number:
Japanese Patent JP5782782
Kind Code:
B2
Abstract:
The present invention provides a detection method which allows specific defects that would occur on a wafer surface to be detected more reliably. A method of detecting a specific defect of the present invention includes the steps of: acquiring a light point map which is in-plane position information of a light point detected in a position corresponding to a defect on a surface of a wafer by irradiating the surface of the wafer with light (S101); specifying a determination region where a specific defect is expected to be formed and a reference region which is a given region other than the determination region in the light point map, and calculating a ratio of a light point density of the determination region to a light point density of the reference region (S102); and determining whether or not the specific defect is formed based on the calculated ratio (S103).
Inventors:
Takeshi Funada
Application Number:
JP2011076376A
Publication Date:
September 24, 2015
Filing Date:
March 30, 2011
Export Citation:
Assignee:
Sumco inc.
International Classes:
G01N21/956; G01B11/00; G01B11/30; H01L21/66
Domestic Patent References:
| JP2005197629A | ||||
| JP2004253603A | ||||
| JP2011521454A |
Foreign References:
| CN100365790C |
Other References:
渋谷久恵 他,欠陥分布パターン照合に基づく問題工程特定技術,精密工学会誌,2009年,Vol.75 No.2,pp.256-261
Attorney, Agent or Firm:
Kenji Sugimura
Keisuke Kawahara
Keisuke Kawahara