Title:
センサ素子モジュール
Document Type and Number:
Japanese Patent JP5783236
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sensor element module which can be downsized in the thickness direction.SOLUTION: The sensor element module includes: a first insulating layer having an opening; a second insulating layer positioned in a laminated state with respect to the first insulating layer in the way that it includes a part above the opening of the first insulating layer; a conductor pattern gripped between the first insulating layer and the second insulating layer; a sensor element chip which has a function surface and is flip connected via a projection electrode onto the conductor pattern that is positioned embedded in the second insulating layer in the way that the function surface is seen through the opening of the first insulating layer and is covered with the second insulating layer except the function surface; and an adhesive resin provided between the sensor element chip and the first insulating layer in the way that it includes the projection electrode inside. The second insulating layer faces a surface opposite to the function surface of the sensor element chip and includes a reinforcement material.
Inventors:
Kenji Sasaoka
Application Number:
JP2013260119A
Publication Date:
September 24, 2015
Filing Date:
December 17, 2013
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L27/14; H01L23/12; H04N5/369; H05K1/18; H05K3/46
Domestic Patent References:
| JP2006253936A | ||||
| JP2006147835A | ||||
| JP2005039094A | ||||
| JP2006156669A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office