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Title:
センサー搭載装置
Document Type and Number:
Japanese Patent JP5785349
Kind Code:
B2
Abstract:
A sensor mounting device (100) of the present disclosure includes: a power supply unit (110) configured to generate power that is to be supplied to the device; a sensor (120) configured to acquire information of the environment around of the device; a first control unit (130) configured to give an instruction based on the information acquired by the sensor (120); and a second control unit (150) configured to control the device in accordance with the instruction of the first control unit (130) Power to the sensor (120) and the first control unit (130) is directly supplied from the power supply unit (110). Power to the second control unit (150) is supplied from the power supply unit (110) via a switching unit (140) whose ON/OFF state is controlled by the first control unit (130).

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Inventors:
Shinichi Shikii
Koichi Kusunoki
Sirawan Nawat
Tatsuo Ito
Application Number:
JP2015512943A
Publication Date:
September 30, 2015
Filing Date:
May 13, 2014
Export Citation:
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Assignee:
Panasonic Intellectual Property Corporation of America
International Classes:
F24F11/02
Domestic Patent References:
JP2001193985A
JP2011069553A
JP2013024463A
JP10191560A
JP2005241056A
JP2010133692A
Foreign References:
WO2011067926A1
Attorney, Agent or Firm:
Patent business corporation Ogasawara patent office