Title:
嵌合型接続端子用Ｓｎ被覆層付き銅合金板及び嵌合型接続端子
Document Type and Number:
Japanese Patent JP5789207
Kind Code:
B2
Abstract:
A copper alloy sheet with a Sn coating layer comprises a base material made of Cu-Ni-Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 µm. Formed on the Ni coating layer is a Cu-Sn alloy coating layer having an average thickness of 0.4 to 1.0 µm. Formed on the Cu-Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 µm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 µm or more and less than 0.15 µm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu-Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.
Inventors:
Tsuru Mayoshi
Oozaki Ryoichi
Koichi Taira
Oozaki Ryoichi
Koichi Taira
Application Number:
JP2012050341A
Publication Date:
October 07, 2015
Filing Date:
March 07, 2012
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
C25D7/00; C22C9/02; C22C9/04; C22C9/06; C25D5/12; C25D5/50; H01R13/03
Domestic Patent References:
| JP2011042860A |
Attorney, Agent or Firm:
Kaoru Kamoto