Title:
粘着テープ貼付け方法および粘着テープ貼付け装置
Document Type and Number:
Japanese Patent JP5797623
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensitive tape affixing method and a pressure sensitive tape affixing device, in which a pressure sensitive tape can be affixed accurately regardless of a state of a circuit formation side of a semiconductor wafer and characteristics of the pressure sensitive tape.SOLUTION: A pressure sensitive tape PT larger than an outer shape of a pair of lower housings 33B constituting a chamber 7 is affixed to a junction of the housings and the pressure sensitive tape is held between the lower housings and an upper housing 33A, thereby configuring the chamber 7. While making atmospheric pressure in a space closer to a wafer W which is disposed while proximately facing a pressure sensitive side of the pressure sensitive tape PT lower than that in the other space, the pressure sensitive tape is then affixed to the wafer W. A surface of the pressure sensitive tape PT affixed to a circuit formation side of the wafer W is flattened by being pressurized with a flat face of a pressurizing member 61. Pressurizing processing of the pressure sensitive tape surface is selectively performed in accordance with a circuit state of the wafer W and characteristics of the pressure sensitive tape PT.
Inventors:
Kanajima Aji
Yukitoshi Hase
Taku Murayama
Masayuki Yamamoto
Yukitoshi Hase
Taku Murayama
Masayuki Yamamoto
Application Number:
JP2012191757A
Publication Date:
October 21, 2015
Filing Date:
August 31, 2012
Export Citation:
Assignee:
Nitto Seiki Co., Ltd.
NITTO DENKO CORPORATION
NITTO DENKO CORPORATION
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2011109008A | ||||
| JP2012060047A | ||||
| JP2009152363A | ||||
| JP2009194064A | ||||
| JP2010141254A | ||||
| JP2006187862A |
Attorney, Agent or Firm:
Tsutomu Sugiya
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname