Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5803303
Kind Code:
B2
Inventors:
Keiichi Yui
Ken Nakata
Makabe Yuu
Takeshi Kawauchi
Ken Nakata
Makabe Yuu
Takeshi Kawauchi
Application Number:
JP2011128649A
Publication Date:
November 04, 2015
Filing Date:
June 08, 2011
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L21/338; H01L21/20; H01L21/205; H01L29/778; H01L29/812
Domestic Patent References:
| JP2007165431A | ||||
| JP9186363A | ||||
| JP8293643A | ||||
| JP11354846A | ||||
| JP2010199597A | ||||
| JP2010182812A | ||||
| JP2009032713A | ||||
| JP2011079728A |
Foreign References:
| WO2010100699A1 |
Attorney, Agent or Firm:
Shuhei Katayama