Title:
電子部品の実装構造体
Document Type and Number:
Japanese Patent JP5805497
Kind Code:
B2
Inventors:
Naoken Eikyu
Application Number:
JP2011235867A
Publication Date:
November 04, 2015
Filing Date:
October 27, 2011
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H03H9/25; H01L21/60; H01L23/02; H01L23/08
Domestic Patent References:
| JP2004215218A | ||||
| JP2005086615A | ||||
| JP2305207A | ||||
| JP3179810A | ||||
| JP2000278091A | ||||
| JP2003283295A | ||||
| JP2003338729A | ||||
| JP2010177559A |
Foreign References:
| WO2008114490A1 | ||||
| WO2011096245A1 |
Attorney, Agent or Firm:
Takahisa Sato