Title:
ワイヤシールの取付方法
Document Type and Number:
Japanese Patent JP5812886
Kind Code:
B2
Inventors:
Akira Miyoshi
Application Number:
JP2012017801A
Publication Date:
November 17, 2015
Filing Date:
January 31, 2012
Export Citation:
Assignee:
ShinMaywa Industries,Ltd.
International Classes:
H01B17/58; H01B13/32; H01R43/28; H02G1/14
Domestic Patent References:
| JP2005012881A | ||||
| JP4340312A | ||||
| JP2025120U |
Attorney, Agent or Firm:
Maeda patent office