Title:
研削盤の測定異常機能付き加工径測定装置
Document Type and Number:
Japanese Patent JP5814111
Kind Code:
B2
Abstract:
An in-process diameter measuring apparatus equipped with a function of determining a measurement abnormality of a grinding machine is provided. The apparatus measures the diameter of a to-be-processed surface of a workpiece in the process of the workpiece. A sizing device (2) is provided including measuring heads (2X and 2Y) for detecting two locations spaced apart from each other in a diametric direction of the workpiece (W). Based on respective measured values of those measuring heads (2X and 2Y), the diametric dimension is calculated by a dimension calculator (32). With respect to the abnormality detection, the difference between the measured values (G1 and G2) of the measuring heads (2X and 2Y) is determined by a measurement abnormality determiner (34) and the occurrence of the measurement abnormality is determined when this measurement value difference (Δα) depart from a predetermined permissible range.
Inventors:
Takashi Nakagawa
Kawasaki Yasushi
Kawasaki Yasushi
Application Number:
JP2011287098A
Publication Date:
November 17, 2015
Filing Date:
December 28, 2011
Export Citation:
Assignee:
ntn corporation
International Classes:
B24B49/10; B23Q17/20; B24B5/35; B24B49/04
Domestic Patent References:
| JP2008161960A | ||||
| JP2003094293A | ||||
| JP2010105129A | ||||
| JP5131352A | ||||
| JP2007030103A |
Attorney, Agent or Firm:
Masashi Noda
Shuji Sugimoto
Shuji Sugimoto