Title:
低減されたクロストークを有するプリント回路基板
Document Type and Number:
Japanese Patent JP5815186
Kind Code:
B2
Abstract:
A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
Inventors:
Kim, Hyun Jun
Conger, jeffrey scott
Scott, Gregory Irwin
Conger, jeffrey scott
Scott, Gregory Irwin
Application Number:
JP2014549049A
Publication Date:
November 17, 2015
Filing Date:
November 01, 2012
Export Citation:
Assignee:
CRAY INC.
International Classes:
H05K3/46; H05K1/02; H05K1/11
Domestic Patent References:
| JP2005276859A | ||||
| JP2007305756A | ||||
| JP2003218480A | ||||
| JP11121928A | ||||
| JP2007528589A |
Foreign References:
| WO2004107830A1 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto