Title:
増幅器及び半導体装置
Document Type and Number:
Japanese Patent JP5815433
Kind Code:
B2
Inventors:
Seiichiro Sasaki
Application Number:
JP2012026542A
Publication Date:
November 17, 2015
Filing Date:
February 09, 2012
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H03F3/45; H03F3/345
Domestic Patent References:
JP2000209043A | ||||
JP2009201044A | ||||
JP5095266A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda