Title:
接触端子構造
Document Type and Number:
Japanese Patent JP5819547
Kind Code:
B2
Abstract:
A contact terminal structure includes: a first plating layer formed on a surface of a substrate; and a second plating layer formed on a surface of the first plating layer as an outermost layer, in which the first plating layer is composed of a silver-tin alloy, the second plating layer is silver plating or an alloy essentially consisting of silver, the first plating layer has a hardness greater than the second plating layer, and the first plating layer has a Vickers hardness of 250 to 400 and the second plating layer has a Vickers hardness of 80 to 200.
Inventors:
Yoshinori Sumitani
Isao Segawa
Isao Segawa
Application Number:
JP2014557656A
Publication Date:
November 24, 2015
Filing Date:
May 29, 2014
Export Citation:
Assignee:
Kanzacc inc.
International Classes:
H01H1/04
Domestic Patent References:
| JP2013231228A | 2013-11-14 | |||
| JP2003181976A | 2003-07-03 | |||
| JP2003160851A | 2003-06-06 | |||
| JP2009079250A | 2009-04-16 |
Attorney, Agent or Firm:
Takayoshi Kusumoto
Satoshi Mikumo
Satoshi Mikumo