防水構造と電子機器及び防水方法

Title:

防水構造と電子機器及び防水方法

Document Type and Number:

Japanese Patent JP5821953

Kind Code:

B2

Abstract:

A waterproof structure includes a package having an opening; a lid part which is slidable between a first position that makes the opening be open and a second position that is located closer to the innermost of the opening than the first position and closes the opening; and an elastic member provided on a surface of the lid part, said surface facing an inner side of the opening, in a manner such that the elastic member is incapable of contacting the package when the lid part is positioned at the first position, and that the elastic member is pressed into the opening when the lid part is positioned at the second position. It is possible to prevent insufficient pressing of the elastic member into the opening, and thereby the relevant waterproof performance can be improved.

Inventors:

Taro Hirose

Application Number:

JP2013515060A

Publication Date:

November 24, 2015

Filing Date:

April 25, 2012

Export Citation:

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