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Title:
導電性粘着テープ
Document Type and Number:
Japanese Patent JP5824478
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive tape excellent in tackiness and conductivity even when an adhesive layer is made thin, and having excellent step-absorbing property and causing no lift from an adherend even when the tape is stuck to a step.SOLUTION: A conductive adhesive tape has an adhesive layer, and has a thickness of 15 to 160 μm, the layer comprises an adhesive that contains a spherical and/or spike-like conductive filler having an aspect ratio of 1.0 to 1.5 by 14 to 45 pts.wt. with respect to 100 pts.wt. of the whole solid content of the pressure-sensitive adhesive excluding the conductive filler, with the conductive filler occupying 90 wt.% or more in the whole filler in the pressure-sensitive adhesive. Particle sizes dand dof the conductive filler and the pressure-sensitive adhesive layer thickness satisfy a relationship of d>(adhesive layer thickness)>d.

Inventors:
Junichi Nakayama
Hiroaki Kishioka
Application Number:
JP2013119826A
Publication Date:
November 25, 2015
Filing Date:
June 06, 2013
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; C09J11/04; C09J133/04; H01B1/00; H01B1/22; H01B5/16
Domestic Patent References:
JP11080682A
JP10338859A
JP10338841A
JP10273540A
JP10273633A
JP10269853A
JP9118860A
JP6084718A
JP2004263030A
JP2005277145A
Attorney, Agent or Firm:
Yukihisa Goto



 
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