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Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5824661
Kind Code:
B2
Inventors:
Tomohiro Fujita
Application Number:
JP2012548288A
Publication Date:
November 25, 2015
Filing Date:
February 28, 2012
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L21/336; H01L21/28; H01L21/283; H01L21/8238; H01L27/092; H01L29/423; H01L29/49; H01L29/78
Domestic Patent References:
JPH11126828A1999-05-11
JP2010272596A2010-12-02
JP2008288465A2008-11-27
JPH11126828A1999-05-11
Foreign References:
US20090152650A12009-06-18
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda



 
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