Title:
表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP5826322
Kind Code:
B2
Inventors:
Masashi Ishii
Akimasa Moriyama
Akimasa Moriyama
Application Number:
JP2014061259A
Publication Date:
December 02, 2015
Filing Date:
March 25, 2014
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; C25D1/04
Domestic Patent References:
| JP6047755A | ||||
| JP2013243396A |
Foreign References:
| WO2013183607A1 | ||||
| WO2014024878A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation